自动焊锡机工作的三个流程：
Three processes for automatic soldering machine operation:
1、润湿：润湿过程是指已经熔化了的焊料借助毛细管力沿着母材金属表面细微的凹凸和结晶的间隙向四周漫流，从而在被焊母材表面形成附着层，使焊料与母材金属的原子相互接近，达到原子引力起作用的距离。
1, wetting: wetting process refers to the gap has melted solder bump and crystallization by capillary force along the surface of the base metal of the fine to the surrounding flow, resulting in the materials to be welded is formed on the surface of the adhesive layer, the solder and base metal atoms close to each other, to the atomic gravity effect distance.
引起润湿的环境条件：被焊母材的表面必须是清洁的，不能有氧化物或污染物。
Environmental conditions causing wetting: the surface of the welded base metal must be clean and free from oxides or contaminants.
2、扩散：伴随着润湿的进行，焊料与母材金属原子间的相互扩散现象开始发生。通常原子在晶格点阵中处于热振动状态，一旦温度升高。原子活动加剧，使熔化的焊料与母材中的原子相互越过接触面进入对方的晶格点阵，原子的移动速度与数量决定于加热的温度与时间。
2. Diffusion: as the wetting proceeds, the interdiffusion between solder and base metal atoms begins to occur. Typically, atoms are in thermal vibrational states in lattice lattices, once the temperature is raised. As the atomic activity intensifies, the molten solder and the atoms in the parent material cross each other into the lattice of each other, and the speed and number of atoms are determined by the temperature and time of the heating.
3、冶金结合：由于焊料与母材相互扩散，在2种金属之间形成了一个中间层---金属化合物，要获得良好的焊点，被焊母材与焊料之间必须形成金属化合物，从而使母材达到牢固的冶金结合状态。
3, metallurgy combination: because solder and base metal interdiffusion between the 2 metals in the formation of a middle layer - metal compound, to obtain good solder joint, is welded between the base metal and solder must form a metal compound, so that the base material to achieve a combination of state firm metallurgy.
